With Ovum analysts forecasting that ITU’s ultra-fast copper technology, G.fast, will support nearly 29 million subscribers by 2021, interoperability between chipsets (for Customer Premises Equipment and Distribution Point Units) is a complex but absolutely vital component for the industry when deploying the technology.
This is the message that I will be delivering on behalf of the Broadband Forum at next week’s ITU Telecom World 2016 in the panel discussion: “Gearing up for Ultra-High Speed Networks,” where I will be joined by fellow panelists Reinhard Scholl, Deputy Director of the ITU Telecommunication Standardization Bureau, and David Bessonen, Senior G.fast Engineer at Telebyte, Inc.
The discussion we will have is taking place at a time when consumer demand for high-speed networks, including gigabit access, is skyrocketing.
It is all very well having the technology, but if standards are not implemented from the start, there will always be limitations. That is why the work of ITU’s Telecommunication Standardization Sector (ITU-T) and the Broadband Forum is so vital as we enter the Gigabit Era.
As the industry continues to embrace G.fast, its success in broadband networks absolutely depends on service providers having a wide choice of equipment and this is where interoperability comes in.
The Broadband Forum’s collaboration with the University of New Hampshire InterOperability Laboratory aims to address exactly this issue and a huge amount of work is going on at the moment to achieve true G.fast interoperability.
The Forum’s work on G.fast builds upon the progress made by the ITU-T, which approved its broadband standard designed to deliver access speeds of up to 1Gbit/s over existing telephone wires in 2014, in conjunction with the Forum’s FTTdp architecture project. ITU-T recently doubled the access speeds achievable with G.fast, raising the bar to 2 Gbit/s.
With collaboration like this, it will be entirely possible for the industry to achieve the high-speed connectivity being sought after by consumers and we are already beginning to see evidence of this.
At Broadband World Forum, in London, the world’s first cross-chipset interoperability demo took place.
A similar demonstration will be held at ITU Telecom World, where Forum member Telebyte, the leader in G.fast Physical Layer testing, will provide a live demonstration of G.fast in a real-world test environment, including products from its ID-337 solution group – based on the Broadband Forum’s ID-337 G.fast Certification Test plan.
Such work pays testament to the work of the Forum and the ITU and with this continued approach, I see no reason why Ovum’s forecast of 29 million by 2021 cannot be surpassed.
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